特种耐热树脂（正常的效果）
高饱和度耐高温防化光敏树脂
本食品含量达到99%上述，远市场场95%的常規含量，都具有耐高温塑料度(吸附室温﹥420℃)、绝缘电阻性挠度高、格局力学特性好的的特征，是特性市场大的的耐熱格局建筑的材料，和H级、C级及上述电力电气绝缘电阻性建筑的材料的很理想不饱和树脂基体。
本食品不适用作硅酸基本装修原料基体不饱和不饱和树脂印章刻制控制pcb电路板(即电源芯片)的产生，能以为统计、航空工业、战略导弹的形式装修原料以其200级之内电气开关接地装修原料的不饱和不饱和树脂基体装修原料。
High purity heat-resistant specialty resin
The purity of this product can reach more than 99%, far exceeding the conventional purity of 95% on the market. This product has the characteristics of high temperature resistance (decomposition temperature > 420 °C), high dielectric strength and good mechanical properties, and is a heat-resistant structural material with excellent performance, and also an ideal resin matrix for H-class, C-class and above electrical insulation materials.
This product is suitable for the manufacture of printed circuit boards (i.e., chips) based on inorganic substrate, can also be used as the structural material of radar, aerospace, missile, and as a resin matrix material of electrical insulation materials above 200℃.
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