特种耐热树脂（白色背景的效果）
高含量耐热性特总光敏树脂
本商品含量多达99%上面的，远生鲜超市场95%的日常含量，有着耐常温(转换的温度﹥420℃)、耐压抗压强度高、磁学耐腐蚀性较好的显著特点，是耐腐蚀性市场大的的耐热性结构特征建材，和H级、C级及上面的电力工程耐压建材的期望树酯基体。
本物料适用人群于有机物材质基体硅胶粘合剂印章刻制电路设计板(即集成ic)的制做，需用为预警雷达、航空、战略导弹的框架材质以其200级大于电绝缘性材质的硅胶粘合剂基体材质。
High purity heat-resistant specialty resin
The purity of this product can reach more than 99%, far exceeding the conventional purity of 95% on the market. This product has the characteristics of high temperature resistance (decomposition temperature > 420 °C), high dielectric strength and good mechanical properties, and is a heat-resistant structural material with excellent performance, and also an ideal resin matrix for H-class, C-class and above electrical insulation materials.
This product is suitable for the manufacture of printed circuit boards (i.e., chips) based on inorganic substrate, can also be used as the structural material of radar, aerospace, missile, and as a resin matrix material of electrical insulation materials above 200℃.
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