特种耐热树脂（边缘虚化的效果）
高溶解度耐热性持种硅胶粘合剂
本设备纯净度led光通量99%以下，远生鲜超市场95%的标准纯净度，有着耐高溫(分析的温度﹥420℃)、耐压硬度高、力学性的性能指标很好的特质，是的性能指标优等的耐热性框架建材，和H级、C级及以下电气开关耐压建材的佳树酯基体。
本货品选用来三聚氰胺光敏树脂胶建材的特性基体光敏树脂胶印刷电源线路板(即单片机芯片)的生产加工，可当为声纳、航空、空空导弹的构造建材已经200级上文电气成套接地建材的光敏树脂胶基体建材。
High purity heat-resistant specialty resin
The purity of this product can reach more than 99%, far exceeding the conventional purity of 95% on the market. This product has the characteristics of high temperature resistance (decomposition temperature > 420 °C), high dielectric strength and good mechanical properties, and is a heat-resistant structural material with excellent performance, and also an ideal resin matrix for H-class, C-class and above electrical insulation materials.
This product is suitable for the manufacture of printed circuit boards (i.e., chips) based on inorganic substrate, can also be used as the structural material of radar, aerospace, missile, and as a resin matrix material of electrical insulation materials above 200℃.
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